Die tilt inspection
With Omron's algorithm you can bond dies or wires correctly to prevent defective products.
Challenge
To bond dies or wires correctly, accurate placement of dies is key. If the die is not placed at correct position it causes defective products. The surface conditions of dies vary making it difficult to confirm that the die is correctly positioned.
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Solution
With Omron's algorithm, optical method and shape of sensing spot, the distance to dies can be measured with better resolution.
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Benefit
Prevents defective products.
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